Mfg Part Number: 82LS181-BJA | Alternate P/N: 82LS181BJA | NSN : 5962-01-293-2278 |
NIIN : 012932278 | CAGE Code : 18324 | Manufacturer: Philips Semiconductors Inc |
Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
When you require top-quality Microcircuit Memory components such as 82LS181-BJA with the NSN 5962-01-293-2278, we have you covered on Aircraft Aftermarket Parts. The particular offering that you have taken an interest in is listed alongside the part number 82LS181-BJA under FSC 5962 Microcircuits Electronic and manufactured by Philips Semiconductors Inc. If you are interested in this NSN part and would like to learn more information, we encourage you to complete the RFQ form on this page at your earliest convenience. Once we have received a completed form, a dedicated account representative will quickly review your information and use it to craft a customized solution that caters to your unique requirements as closely as possible. Additionally, with team members working around the clock for customer needs, you should receive a response for your 82LS181-BJA NSN part in just 15 minutes from the receipt of a completed form.
Part number 82LS181-BJA was specifically manufactured under the CAGE Code 18324, which belongs to Philips Semiconductors Inc. To ensure that you only procure the exact items that you are in search of, we always list our offerings with all applicable information. If you have any questions or concerns regarding our services, give us a call or email at your earliest convenience, and we would be more than happy to assist you however we can!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-293-2278 Item Description: MICROCIRCUIT,MEMORY | 5962 | 012932278 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
82LS181/BJA | 2 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAT | BODY WIDTH | 0.560 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.130 INCHES MINIMUM AND 0.170 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | 55.0/+125.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND BIPOLAR |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
ADAQ | BODY LENGTH | 1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 225.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 225.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
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